| Manufacturer | Xilinx |
| Series | Kintex® UltraScale™ |
| Package | Tray |
| Description | Kintex® UltraScale™ Field Programmable Gate Array (FPGA) IC 520 38912000 725550 1156-BBGA, FCBGA |
| Manufacturer Standard Lead Time | 16 Weeks |
| Product Status | Active |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Mounting Type | Surface Mount |
| Package / Case | 1156-BBGA, FCBGA |
| Supplier Device Package | 1156-FCBGA (35×35) |
| Base Product Number | XCKU060 |
| Product Type: | FPGA – Field Programmable Gate Array |
This FPGA offers a high level of performance and integration suitable for a wide range of applications, including data center, wireless communication, aerospace, and defense. The “FFVA1156” package indicates a flip-chip fine-pitch ball grid array package with 1156 pins, providing a high-density packaging solution for complex designs. Whether in data centers, telecommunications infrastructure, aerospace systems, or industrial automation, the XCKU060-1FFVA1156C excels in delivering performance, flexibility, and reliability for demanding applications