| Manufacturer | Samsung Electro-Mechanics |
| Series | – |
| D/C | Within 2 years |
| Density | 32GB |
| Organization | x32 |
| Speed | 4266 Mbps |
| Voltage | 1.8 / 1.1 / 0.6 V |
| Temperature | -25 ~ 85 °C |
| Package | 200 FBGA |
| Product Status | Mass Production |
| ECCN | EAR99 |
The K4UBE3D4AB-MGCL is a DRAM chip from Samsung Electronics. Specifically, it is a Mobile LPDDR4X SDRAM with a 256Gbit capacity, organized as 8Gx32, and operates at 1.1V/1.8V. It comes in a 200-pin FBGA package. This type of memory is designed for use in mobile devices, providing high-density and low-power consumption for applications requiring efficient performance and extended battery life.