Our trained QC engineers use a state of the art, multi-step inspection detection processes to identify counterfeit and cloned products. The process begins with analyzing the shipping and packaging. It continues with the parts undergoing several levels of inspection including: marking and dimension checks, internal visual analysis, material analysis and electrical testing to insure the safety of the production.
-   Inspection of external and internal packing
-   Inspection of part number, date code, package, quantity
-   Label comparison with picture database
-   IC marking comparison with picture database
-   Measuring of the physical dimensions of the component
-   Inspection of the condition of the pins or balls for the component
- Inspection of the inside bond arrangement of the die via X-Ray
- Ship the parts to test lab to perforum the Level 2(Visual inspection test decapsulation) and Level 3(Electronic Functional test) based on our customer reqirement.
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